CTP Direct Platemaking Technology Features and Application Development (in)

Third, the thermal technology and its characteristics

In order to solve the silver salt version of the existence of expensive, difficult to save and other issues, people began to find new ways to solve the CTP technology. This kind of thermal technology came into being. Thermal technology is a big concept, and the way it is implemented is also diverse. At present, the major thermal CTP technologies include heat-sensitive curing technology, thermal decomposition technology, and heat-free processing technology. The lasers used in these technologies are all infrared lasers, but the imaging mechanism is different. The heat-sensitive curing technology uses a laser beam scan to photopolymerize the photosensitive layer of the dot portion. In the developing process, the reacting photosensitive layer is insoluble, and the photosensitive layer that is not scanned by the laser beam dissolves. The imaging mechanism of the thermo-decomposition technique is the inverse of the decomposition reaction of the laser beam. In the development process, the reacting photosensitive layer is dissolved, and the photosensitive layer that is not scanned by the laser beam is insoluble. The heat-free technology eliminates the need to develop printed information by melting it into a hydrophilic silicon layer using a thermal laser beam. Either way, there is no silver salt component in the photosensitive material of the thermal plate. This fundamentally solved the issue of expensive plate materials. Although the prices of thermal plates currently on the market are still somewhat high, such prices are not a true reflection of manufacturing costs. From a development perspective, the overall price of the thermal plate should be close to the price of the widely used conventional PS plate. The thermal CTP system has the best plate-making quality. Both the thermal negative plate and the positive plate can provide image reduction and printing performance. The thermal exposure light source of the thermal plate is a thermal laser. Under normal storage conditions, the photosensitive layer of the thermal plate does not change. Therefore, the thermal plate should be stored without any problems, and the operation of the thermal plate is required. It can be done in the bright room, which is a leap. Although users are often faced with the problem of thermal plate failure, this is caused by the process control of the plate material manufacturing company during the process of preparing the sensitizer, and has nothing to do with the technical approach. Thermal technology also has certain problems.

The first is the complexity of the system. The thermal CTP technology itself is more and more, the polymer system that can realize the thermal plate making purpose is more, and there is no technology in the field of thermal CTP, can get everyone like the 215 sensitizer used in the traditional PS plate With common approval, all production companies also have their own opinions and do not show weaknesses. This brings a lot of trouble to the user's choice. Secondly, the thermal sensitivity (sensitivity) of the plate is relatively low, and the minimum imaging exposure is generally above several hundred mJ/cm2, which is much higher than other imaging materials systems. In order to compensate for the shortcomings of the thermal sensitivity of the thermal plate, a high-power laser is generally required to achieve a practical and practical plate-making speed. Although the high power of the infrared laser compensates for the weak sensitivity of the thermal sensitivity to some extent, the power of the infrared laser cannot be increased without limit. Therefore, this also limits the application of the thermal technology to some extent.

Secondly, the requirements for the development conditions of the thermal plate, especially the temperature requirements, are very severe. Once the temperature exceeds the specified development temperature, the photosensitive layer may be completely dissolved and the plate becomes “white plate”. Despite the above problems, the thermal imaging CTP is still the mainstream of the direct platemaking technology due to its good imaging and post-operational characteristics, and the mature infrared laser technology, high power, and low price. Continued development and application in offset printing (including conventional waterless and waterless offset printing) and flexographic CTP. In particular, post-processing of thermal plate has become an important direction for the development of thermal imaging CTP, and it is also a strong point of thermal imaging relative to photosensitive imaging. It has a great advantage in the field of CTP direct plate making technology.

For example, in the United States, thermal plates dominate the CTP market, accounting for 75% of the CTP market share. In the case of thermal plates, no-rinsing has always been an ideal target for thermal plates, from the first generation of thermal plates that require preheating before plate processing, to the second generation of thermal plates that do not require preheating. The version, until the third generation does not need to preheat and rinse the thermal version, the rapid development, it is unexpected. For example, Agfa’s no-clean thermal plate, called Mistral, has a sensation peak near 1064 nm. It uses a thermal ablation technique. It coats the surface of the plate with a thin layer of silver halide, which is vaporized during exposure. The ink-printing image area can be printed without the need of stencil printing. The vaporizer is sucked out with a unique vacuum device and three-stage filtration is used. The filter paper core can be replaced regularly, eliminating the need for syrup and plate processor. It is very convenient and environmentally friendly. According to the company, the currently available flush-free plates are ideally suited for in-drum platesetters because they require very short dwell times on the plate, and only high-speed scanning of the inner drum equipment can satisfy the requirement. This requirement. Compared with the previous two generations of products, the third-generation material saves a lot of troubles in use, has better stability, shortens the production process, and can also invest less in an inexpensive plate processor, plus this exemption. The resolving power of the flushing plate is further improved compared with the ordinary thermal plate, reaching 300 lpi (reduction of 1% to 99% of the dots), and the printing resistance of the baking plate is not required to reach more than 500,000 printings. These are enough for users who are ready to consider purchasing a thermal CTP device to make this device and media the first choice

(to be continued)

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