Low air pressure test chamber GB/T 4937.2-2006 "Semiconductor device mechanical and climatic test methods Part 2 low air pressure" This section applies to the low pressure test of semiconductor devices. The purpose of this test is to determine the ability of components and materials to avoid electrical breakdown failures caused by a decrease in the dielectric strength of air and other insulating materials as the air pressure is reduced. This test is only applicable to devices with operating voltages exceeding 1000V.
Low pressure test chamber GB/T4937.2-2006 This test applies to all semiconductor devices. This test is only applicable to the military and space fields.
This low pressure test method is generally consistent with IEC 60068-2-13, but in accordance with the special requirements of semiconductor devices, the provisions of this section are used.
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